HP | HPQ - Loan Capital


HP reported $7.87B in Loan Capital for its fiscal quarter ending in June of 2026.





Loan Capital Change Date
3D Systems USD 87.24M 454K Jun/2026
Accenture USD 10B 4.97B Jun/2026
Advanced Micro Devices USD 2.35B 1000K Jun/2026
Amphenol USD 17.18B 537.7M Jun/2026
Apple USD 71.34B 3.06B Jun/2026
Applied Materials USD 5.24B 11M Jun/2026
Broadcom USD 57.17B 5.49B Jun/2026
Canon JPY 404.32B 76M Jun/2026
CDW USD 4.81B 173M Jun/2026
Ciena USD 3.23B 1.71B Jun/2026
Cisco Systems USD 19.37B 1000K Jun/2026
CommScope USD 7.26B 1.98B Dec/2025
Corning USD 7.76B 38M Jun/2026
F5 Networks USD 0 0 Dec/2024
Hewlett Packard USD 17.34B 894M Jun/2026
HP USD 7.87B 988M Jun/2026
IBM USD 56.21B 1.49B Jun/2026
Intel USD 48.55B 5.52B Jun/2026
Jabil Circuit USD 2.88B 1000K Jun/2026
KLA Corporation USD 5.89B 352K Jun/2026
Lam Research USD 3.73B 106K Jun/2026
Lenovo USD 5.67B 1.81B Jun/2026
Micron Technology USD 4.69B 1.64B Sep/2026
Microsoft USD 31.07B 356M Jun/2026
Motorola Solutions Msi USD 8.42B 2M Jun/2026
NCR USD 1.1B 1000K Jun/2026
NetApp USD 1.94B 549M Jun/2026
Nvidia USD 32.37B 24.9B Jun/2026
Oracle USD 117.71B 4.63B Jun/2026
Qualcomm USD 12.78B 1.99B Jun/2026
Ricoh JPY 348.24B 12.06B Jun/2026
Sanmina USD 1.96B 42.45M Jun/2026
Seagate Technology USD 3.38B 85M Jun/2026
Seiko Epson JPY 165.75B 2.38B Jun/2026
Sensata Technologies USD 2.42B 404.6M Jun/2026
SYNNEX USD 3.6B 1.17M Jun/2026
TE Connectivity USD 5.53B 23M Jun/2026
Western Digital USD 2.43B 28M Dec/2025
Xerox USD 3.48B 785M Jun/2025